Foxconn forms joint venture to build chip fab in Malaysia • The Register
Taiwanese contract manufacturer to the stars Foxconn is to build a chip fabrication plant in Malaysia. The planned factory will emit 12-inch wafers, with process nodes ranging from 28 to 40nm, and will have a capacity of 40,000 wafers a month. By way of comparison, semiconductor-centric analyst house IC Insights rates global wafer capacity at … Read more